Introduction to Flexible Circuit Materials Presented by: Jonathan C. Li 簡報大綱 軟性電路板基材之介紹 基材的主要Composition Dielectric Substrates (絕緣體) Adhesive (膠質) Conductor (導體) 簡報大綱 (continue) 杜邦產品 壓克力膠系列(Modified WA Acrylic)之基材 環亞樹脂膠系列(Modified Epoxy)之基材 杜邦 料號解說 Pyralux® Telcam® 軟性電路板之主要基材 Copper Clad Laminates (銅箔基材) Single-Sided C.C.L.(單面銅箔基材) 軟性電路板之主要基材 Double-Sided C.C.L. .(雙面銅箔基材) 軟性電路板之主要基材 Adhesive-Less C.C.L. .(無膠銅箔基材) 軟性電路板之主要基材 Coverlay(覆蓋膜) 軟性電路板之主要基材 Stiffner (補強材) 軟性電路板之主要基材 Bondply 軟性電路板之主要基材 Sheet Adhesive PhotoImageable Coverlay (PIC) Dry Film Fine-Line Application Camera Automotive Others Dielectric Substrates Definition A base film on which the printed conductors are laid. A film which provides electrical insulation between conductors. A film which provides mechanical strength of the circuit. www.m448 中国最大的欧亿·体育（中国）有限公司库下载